(a) (b) (c) 1. part no. expression : (b) dimension code (a) series code 2. conf igurat ion & di me ns ions : sps252012d series smd power inductor pg. 1 note : specifications subject to change without notice. please check our website for latest information. 15.08.2013 bd 0.80 ref. e unit:m/m 2.5 a c 1.2 max. 0.85 ref. superworld electronics (s) pte ltd s p s 2 5 2 0 1 2 d r 4 7 m f +0.3 -0.1 2.0 +0.35 -0.05 a b c d e d 3. mate ri als : (a) core : ferrite core (b) coating : epoxy with magnetic powder (c) termination : tin pb free (d) wire :enameled copper wire c d b a (e) (e) tolerance code : m=20% (d) inductance code : r47 = 0.47 h exposed wire tolerance limit of coating resin part on product side. size of exposed wire occurring to coating resin is specified below. 1. width direction dimension a acceptable when a Q w/2 nonconforming when a w/2 2. length direction dimension b dimension b is not specified. 3. the total area of exposed wire occurring to each sides is not greater than 50% of coating resin area, and is acceptable. b a w (d) (c) material code (f) (f) f : rohs compliant
pg. 2 4. electrical characteristics : sps252012dr47mf part number 0.68 2.2 1.0 0.47 inductance ( h ) dcr 20% 0.062 0.117 max. ( ? ) 0.055 0.039 isat 3.00 2.00 3.70 3.80 max. ( a ) frequency 0.1v/1m ( hz ) test tolerance ( % ) 2.30 3.80 4.40 typ. ( a ) 4.70 isat 0.1v/1m 0.1v/1m 0.1v/1m superworld electronics (s) pte ltd dcr 0.047 0.098 typ. ( ? ) 0.042 0.029 irms 3.00 2.20 3.50 3.90 typ. ( a ) irms 2.70 1.90 2.90 3.30 max. ( a ) 20% 20% 20% 5. ge ne ral sp ecif ication : 15.08.2013 note : specifications subject to change without notice. please check our website for latest information. (b) isat based on inductance change ( l/l0 Q -30%) (c) irms based on temperature rise ( t 40c) (a) ambient temp. : 25c (d) operating temperature : -40~+85c (for products in unopened tape package, less than 40c) smd power inductor sps252012dr68mf SPS252012D1R0MF sps252012d2r2mf sps252012d series
pg. 3 6. characteristic curves : superworld electronics (s) pte ltd 15.08.2013 note : specifications subject to change without notice. please check our website for latest information. smd power inductor sps252012d series sps252012d r47m f sps252012dr68m f sps252012d 1r0m f sps252012d2r2m f
thermal shock test mil-s td -202 me th od 107 3 2 1 total:100 cycles step conditions for 1 cycle. room temperature 85+5 -552 303 303 temperature (c) times (min.) within5 superworld electronics (s) pte ltd pg. 4 7. re li abil it y and te st condition: humidity test solderability test r es i s tanc e to soldering h umi di ty : 90-95% time : 5008 hrs temperature : 402c time: 101.0 sec temp.: 2605c refer to standard electrical characteristics list performance electrical characteristics test inductance l item agilent-4291, agilent- 4287 a gi l ent-4291 test condition 1. inductors shall be no evidence of electrical and to drop approximately l(%). saturation dc current (isat) will cause l0 a gi l ent-4338 measured at room temperature after placing for 2 to 3hrs heat b as e on temp. ri s e & l/l0a 30%. Q q srf dc resistance rated current rise approximately t(c) wit hout core loss. heat rated current (irms) will cause the coil temperature t 40cmax temperature rise test 1.applied the allowed dc current. 2.temperature measured by digital surface thermometer mechanical performance test mil-s td -202 me th od 210 mechanical dam age. 2. inductance : within 10% of initial value ansi/j-std-002 more than 95% of terminal electr ode should be c ov ered w i th solder. bath at 2355c for 41sec onds. after fluxing,component shall be dipped in a melted solder 150c 41.0 seconds 60 seconds preheating 235c dipping natural cooling reliability test mil-s td -202 me th od 103 1.visual examination n o mechanical damage 2.inductance within10% of initial value measured at room temperature after placing for 2 to 3 hrs smd power inductors (rohs compliant) note : specifications subject to change without notice. please check our website for latest information. 15.08.2013 sps252012d series
superworld electronics (s) pte ltd pg. 5 7. re li abil it y & te st condition : item performance test condition high temperature life test duration : 5008 hrs. temperature : 852c mil-s td -202 me th od 108 low temperature time:5008hr. temperature : -402c storage test measured at room temperature after placing for 2 to 3 hrs amplitude: 1.52mm frequency: 10-55-10hz for 15 min. random vibration test mil-s td -202 method 204 directions and times: x, y, z directions for 15 min. this cycle shall be performed 12 times in each of three mutually perpendicular directions (total 9hours). 1.visual examination n o mechanical damage 2.inductance within10% of initial value measured at room temperature after placing for 2 to 3 hrs jesd22-a119 h umi di ty :90~ 95% temperature:402c humidity resistance test mil-s td -202 me th od 103 time:5008hr. recovery:2 to 3hrs of recovery under the standard condition after the removal from test chamber. appearance: cracking, shipping and any other defec ts harmful to the c harac teristics should not be allowed. smd power inductors (rohs compliant) note : specifications subject to change without notice. please check our website for latest information. 15.08.2013 sps252012d series inductance w ithin10%
pg. 6 8. soldering and mounti ng : products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that a) preheat circuit and products to 150c. b) 355c tip temperature (max) c) never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. reflow times: 3 times max. time(sec.) 60~150s 20~40s s olde ring temperature c 4 80s max. 60~180s 150 25 tp(260c/40s max.) 217 200 preheating note : g rad ual cooling cooling natural temperature c o ver 60s iron soldering times: 1 times max. preheating 350 150 w i t h i n 4-5s s olde ring e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4-5 secs. d) 1.0mm tip diameter (max) cooling natural 8-1. recommended pc board pattern 9-2.2 soldering iron (figure 2) : 9-2.1 lead free solder re-flow : wave and re-flow soldering systems. if hand soldering cannot be avoided, the preferred technique is the utilization of hot by the difference in coefficients of expansion between solder, chip and substrate. the terminations are suitable for all mildly activated rosin fluxes are preferred. the minimum amount of solder can lead to damage from the stresses caused recommended temperature profiles for re-flow soldering in figure 1. air soldering tools. 9-2. soldering 2.9 2.4 0.8 time(sec.) superworld electronics (s) pte ltd 15.08.2013 note : specifications subject to change without notice. please check our website for latest information. smd power inductor fig.1 fig.2 sps252012d series
9. packaging information : 9-1. reel dimension d b c a c(mm) 130.8 7" x 8mm 7" x 8mm 50 min. 8.41.0 type b(mm) a(mm) 1782 d(mm) p po:40.1 9-2 tape dimension / 8mm p2:20.05 w:8.00.1 ao bo ko t ko(mm) 1.400.1 sps252012 3.100.1 2.450.1 series bo(mm) ao(mm) 4.00.1 p(mm) 0.230.05 t(mm) 9-3 packaging quantity chip / reel 2000 series sps252012 bottom view superworld electronics (s) pte ltd pg. 7 15.08.2013 note : specifications subject to change without notice. please check our website for latest information. smd power inductor sps252012d series
application notice a) temperature and humidity conditions : less than 40c and 60% rh. to maintain the solderabililty of terminal electrodes : b) recommended products should be used within 12 months from the time of delivery. c) the packaging material should be kept where no chlorine or sulfur exists in the air. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion and mechanical shock are minimized. a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. transportation : 1. storage conditions : 9-4. tearing off force top cover tape f 165 to 180 860~1060 room atm in the arrow direction under the following conditions. the force for tearing off cover tape is 15 to 80 grams base tape 5~35 (c) room temp. (%) 45~85 room humidity (mm/min) teari ng speed (hpa) 300 superworld electronics (s) pte ltd pg. 8 15.08.2013 note : specifications subject to change without notice. please check our website for latest information. smd power inductor sps252012d series
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